GENERAL DESCRIPTION
The continuing reduction of component sizes in semiconductor production has placed increasing demands on materials which will satisfy these high standards. Thin-walled and miniaturised components require materials with a pronounced degree of dimensional stability and excellent machinability.
TECAPEEK ® CMF is a composite engineering thermoplastic based upon a mixture of PolyEtherEtherKetone (PEEK) or PolyArylEtherKetone (PAEK) polymer blended with a technical ceramic.
TecaPEEK CMF fully complies with the exacting standards demanded by the semiconductor industry. The proven and tested thermal stability and machinability of unfilled TecaPEEK have been retained, but the addition of the ceramic filler offers exceptionally low water absorption, outstanding hardness and rigidity combined with excellent dimensional stability. The even distribution of the incorporated silicate ceramic discs also offers a high barrier to permeation by gases and liquids.
TECAPEEK ™ CMF is available in pre-molded sheet shape only and is WHITE in color or GREY upon request.PROPERTIES • Outstanding thermal stability
• Very good hardness and rigidity
• Good machinability, very low burring
• Good dimensional stability
• Low water absorption
• Good corrosion resistance
• High thermal resistance
• Good dielectric properties
( see also Standard TECAPEEK grades, TECAPEEK TS, TECAPEEK ELS nano, and other TECAPEEK Family products )
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TYPICAL PROPERTIES of TECAPEEK ™ CMF | ||||
| ASTM or UL test | Property | TecaPEEK™ CMF | ||
| PHYSICAL | ||||
| D792 | Density (lb/in³) (g/cm³) |
0.059 1.64 |
||
| D570 | Water Absorption, 24 hrs (%) | 0.04 | ||
| MECHANICAL | ||||
| D638 | Tensile Strength (psi) | 15,000 | ||
| D638 | Tensile Modulus (psi) | 798,000 | ||
| D638 | Tensile Elongation at Break (%) | 4.0 | ||
| D790 | Flexural Strength (psi) | - | ||
| D790 | Flexural Modulus (psi) | 769,000 | ||
| D695 | Compressive Strength (psi) | 23,000 | ||
| D695 | Compressive Modulus (psi) | 565,000 | ||
| D785 | Hardness, Rockwell | - | ||
| D256 | IZOD Notched Impact (ft-lb/in) | - | ||
| THERMAL | ||||
| D696 | Coefficient of Linear Thermal Expansion (x 10-5 in./in./°F) |
2.4 | ||
| D648 | Heat Deflection Temp (°F / °C) at 264 psi |
426 / 219 | ||
| D3418 | Glass Transition Temp (°F / °C) | - / - | ||
| - | Max Operating Temp (°F / °C) | 500 / 260 | ||
| C177 | Thermal Conductivity (BTU-in/ft²-hr-°F) (x 10-4 cal/cm-sec-°C) |
- - |
||
| UL94 | Flammability Rating | - | ||
| ELECTRICAL | ||||
| D149 | Dielectric Strength (V/mil) short time, 1/8" thick | - | ||
| D150 | Dielectric Constant at 1 MHz | - | ||
| D150 | Dissipation Factor at 1 MHz | - | ||
| D257 | Volume Resistivity (ohm-cm)at 50% RH | > 1014 | ||
NOTE: The information contained herein are typical values intended for reference and comparison purposes only. They should NOT be used as a basis for design specifications or quality control. Contact us for manufacturers' complete material property datasheets.TECAPEEK is a registered trademark of Ensinger Industries, Inc.
All values at 73°F (23°C) unless otherwise noted.
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Copyright Boedeker Plastics, Inc.