GENERAL PROPERTIES
Semitron® MP370 was developed to offer new material options for the design and manufacture of precision test sockets for the semiconductor manufacturing industry. It offers significant performance advantages over unfilled PEEK while maintaining the moisture resistance and high thermal performance that makes PEEK an attractive material choice.
Specifically, Semitron MP370 gives the designer a machinable platform that has enhanced thermal resistance, toughness and higher strength performance versus unfilled PEEK. This custom formulation offers the next level of performance without the failings of injection molded blanks (high internal stress, inconsistent properties) or traditional ceramic-filled materials (poor machinability).
Semitron® MP370 is WHITE in color and available in several thicknesses of sheet or plate only.
KEY BENEFITS
- Very low moisture absorption
- Excellent machinability - very small holes and tight hole patterns are possible
- Strength and stiffness that exceed unfilled PEEK materials
- Low internal stresses and no "soft center" problems associated with injection molded blanks
COMMON APPLICATIONS
- IC test sockets for semiconductor manufacturing equipment
- Structural parts in electronics and telecom equipment
- Insulating blocks and fixtures in diagnostic equipment
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TYPICAL PROPERTIES of SEMITRON® MP 370 | ||||
| ASTM or UL test | Property | Semitron® MP-370 | ||
| PHYSICAL | ||||
| D792 | Density (lb/in³) (g/cm³) |
0.059 1.62 |
||
| D570 | Water Absorption, 24 hrs (% by wt) | 0.11 | ||
| D570 | Water Absorption, saturation (% by wt) | 0.50 | ||
| MECHANICAL | ||||
| D638 | Tensile Strength (psi) | 11,500 | ||
| D638 | Tensile Modulus (psi) | 640,000 | ||
| D638 | Tensile Elongation at Break (%) | 3 | ||
| D790 | Flexural Strength (psi) | 16,750 | ||
| D790 | Flexural Modulus (psi) | 625,000 | ||
| D695 | Compressive Strength (psi) | 18,200 | ||
| D695 | Compressive Modulus (psi) | 600,000 | ||
| D785 | Hardness, Rockwell | M98 | ||
| D256 | IZOD Notched Impact (ft-lb/in) | 0.4 | ||
| THERMAL | ||||
| D696 | Coefficient of Linear Thermal Expansion (x 10-5 in./in./°F) |
2.5 | ||
| D648 | Heat Deflection Temp (°F / °C) at 264 psi |
300 / 149 |
||
| D3418 | Glass Transition Temp (°F / °C) | 320 / 160 | ||
| - | Max Operating Temp (°F / °C) | 480 / 249 | ||
| C177 | Thermal Conductivity (BTU-in/ft²-hr-°F) (x 10-4 cal/cm-sec-°C) |
2.36 8.13 |
||
| UL94 | Flammability Rating | V-0 | ||
| ELECTRICAL | ||||
| D149 | Dielectric Strength (V/mil) short time, 1/8" thick | 376 | ||
| D150 | Dielectric Constant at 1 MHz | 4.13 | ||
| D150 | Dissipation Factor at 1 MHz | 0.004 | ||
| EOS/ESD S11.11 | Surface Resistivity (ohms/square) | > 1013 | ||
| EOS/ESD S11.11 | Volume Resistivity (ohms-cm) | > 1015 | ||
NOTE: The information contained herein are typical values intended for reference and comparison purposes only. They should NOT be used as a basis for design specifications or quality control. Contact us for manufacturers' complete material property datasheets.SEMITRON is a registered trademark of Quadrant Engineering Plastic Products.
All values at 73°F (23°C) unless otherwise noted.
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Copyright Boedeker Plastics, Inc.