GENERAL PROPERTIES
Semitron® MDS 100 was developed to offer a remarkable combination of high strength, low moisture absorption, high stiffness and the resulting dimensional stability. Its unique, proprietary polymer matrix makes it ideal for use in parts where fine machining and precise tolerances are critical. As a result, Semitron MSD-100 is an ideal choice for semiconductor test sockets, nests and fixtures in used in electrical test and packaging equipment.
With a Flexural Modulus (ASTM D790) in excess of 1,400,000 psi and extremely low moisture absorption (24 hr., ASTM D570) of .10%, Semitron MDS 100 delivers performance that solves engineering problems associated with uncontrolled application environments. Its low Coefficient of Linear Thermal Expansion (ASTM E831) of 1.1 x 10-5 also contributes to its remarkable stability. The Heat Deflection or softening temperature (ASTM D648) is 410° F (210° C)
Semitron® MDS 100 is LIGHT GREY in color and available in sheet or plates ranging in thicknesses from 1 mm to 6 mm (.04 to .236") in sheet sizes of 250 mm x 250 mm (9.84") and 500 mm x 500 mm (19.68"). Other thicknesses are possible.
KEY BENEFITS
- Extremely low moisture absorption
- Excellent machinability - very small holes and tight hole patterns are possible
- Very high strength and stiffness that exceed unfilled PEEK materials
- Low internal stresses and no "soft center" problems associated with injection molded blanks
COMMON APPLICATIONS
- IC test sockets for semiconductor manufacturing equipment
- Fixtures for electronics testing
- Mounting points for precision diagnostic equipment
- Positioning platforms for miniature motion control devices.
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TYPICAL PROPERTIES of SEMITRON® MDS 100 | ||||
| ASTM or UL test | Property | Semitron® MDS-100 | ||
| PHYSICAL | ||||
| D792 | Density (lb/in³) (g/cm³) |
0.055 1.51 |
||
| D570 | Water Absorption, 24 hrs (% by wt) | 0.10 | ||
| MECHANICAL | ||||
| D638 | Tensile Strength (psi) | 14,700 | ||
| D638 | Tensile Modulus (psi) | 1,500,000 | ||
| D638 | Tensile Elongation at Break (%) | 1.5 | ||
| D790 | Flexural Strength (psi) | 20,500 | ||
| D790 | Flexural Modulus (psi) | 1,425,000 | ||
| D695 | Compressive Strength (psi) | - | ||
| D695 | Compressive Modulus (psi) | - | ||
| D785 | Hardness, Rockwell | R121 | ||
| D256 | IZOD Notched Impact (ft-lb/in) | - | ||
| THERMAL | ||||
| D696 | Coefficient of Linear Thermal Expansion (x 10-5 in./in./°F) |
1.1 | ||
| D648 | Heat Deflection Temp (°F / °C) at 264 psi |
410 / 210 |
||
| D3418 | Glass Transition Temp (°F / °C) | 320 / 160 | ||
| - | Max Operating Temp (°F / °C) | 480 / 249 | ||
| C177 | Thermal Conductivity (BTU-in/ft²-hr-°F) (x 10-4 cal/cm-sec-°C) |
- - |
||
| UL94 | Flammability Rating | - | ||
| ELECTRICAL | ||||
| D149 | Dielectric Strength (V/mil) short time, 1/8" thick | 362 | ||
| D150 | Dielectric Constant at 1 MHz | 3.37 | ||
| D150 | Dissipation Factor at 1 MHz | 0.007 | ||
| EOS/ESD S11.11 | Surface Resistivity (ohms/square) | - | ||
| EOS/ESD S11.11 | Volume Resistivity (ohms-cm) | - | ||
NOTE: The information contained herein are typical values intended for reference and comparison purposes only. They should NOT be used as a basis for design specifications or quality control. Contact us for manufacturers' complete material property datasheets.SEMITRON is a registered trademark of Quadrant Engineering Plastic Products.
All values at 73°F (23°C) unless otherwise noted.
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