DESCRIPTION Tecaform ® SD (formerly known as Hydel ® ASD) is an acetal base material that has been filled with an inherently dissipative polymer (IDP) additive. IDP's have no carbon or graphite content and do not slough conductive particles. This material has consistent electrical properties, good wear resistance, broad chemical resistance, and machines very easily.
Tecaform ® SD is natural (tan) in color and is available in sheet, rod, tubular bar and profile forms.
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PROPERTIES of TECAFORM ® SD Acetal | ||||
| ASTM or UL test | Property | Tecaform ® SD | ||
| PHYSICAL | ||||
| D792 | Density (lb/in³) (g/cm³) |
0.048 1.33 |
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| D570 | Water Absorption, 24 hrs (%) | 2.0 | ||
| MECHANICAL | ||||
| D638 | Tensile Strength @ Break (psi) | 6,400 | ||
| D638 | Tensile Modulus (psi) | 220,000 | ||
| D638 | Tensile Elongation @ Break (%) | 15 | ||
| D790 | Flexural Strength (psi) | - | ||
| D790 | Flexural Modulus (psi) | 215,000 | ||
| D790 | Compressive Strength (psi) | - | ||
| D256 | IZOD Impact Notched (ft-lb/in) | 1.2 | ||
| D785 | Hardness, Rockwell | 110 R | ||
| THERMAL | ||||
| D696 | Coefficient of Linear Thermal Expansion (x 10-5 in./in./°F) |
9 | ||
| C177 | Thermal Conductivity (BTU-in/ft²-hr-°F) (x 10-4 cal/cm-sec-°C) |
- - |
||
| D648 | Heat Deflection Temp (°F / °C) at 264 psi |
215 / 102 |
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| - | Max Operating Temp (°F / °C) | 180 / 82 | ||
| UL94 | Flammability Rating | - | ||
| ELECTRICAL | ||||
| D149 | Dielectric Strength (V/mil) short time, 1/8" thick | - | ||
| D150 | Dielectric Constant at 1 KHz | - | ||
| D257 | Surface Resistivity (ohms/sq) | 1010 - 1011 | ||
| D257 | Volume Resistivity (ohm-cm) at 50% RH | 1010 - 1011 | ||
NOTE: The information contained herein are typical values intended for reference and comparison purposes only. They should NOT be used as a basis for design specifications or quality control. Contact us for manufacturers' complete material property datasheets.TECAFORM is a registered trademark of Ensinger-Hyde
All values at 73°F (23°C) unless otherwise noted.
©
Copyright Boedeker Plastics, Inc.
2008