BACKGROUND The chemical mechanical planarization (CMP) process plays a critical role in the manufacture of today's advanced semiconductor "chips." It is a highly accurate polishing process that flattens and smoothes the surface of a silicon wafer, creating a highly uniform surface upon which multiple layers of intricate chip circuitry are built. This results in high-performance chips that are driving today's most advanced electronics. As new generations of chips become increasingly smaller -- below 0.35 micron -- CMP becomes more essential in maintaining a wafer's integrity. Benefits to the chipmakers include higher performance and more reliable chips at a lower cost of ownership.
GENERAL DESCRIPTION Boedeker Plastics is proud to introduce the latest members of Quadrant Engineering Plastic Products' family of high performance materials for use in the semiconductor processing equipment industry.
Semitron CMP LL5 and Semitron CMP XL20 materials are now available for fabrication into CMP rings and other machined parts. Both materials offer significant extended life capabilities over standard PolyPhenylene Sulfide products.
( see also Techtron PPS Specifications )
SEMITRON ® CMP GRADES Semitron ® CMP LL5
Specially developed from enhanced polyester-based resin, Semitron CMP LL5 features wear life in excess of 5 times over standard PPS when used in Oxide chemistries. This longer wear life translates into lower costs for all CMP chemistries, and is ideal for use in designs that utilize steel or ceramic ring reinforcement.
Semitron ® CMP XL20
Semitron CMP XL20 was developed from a proprietary polyamide-base resin and offers wear life more than 20 times that of standard PPS in all CMP chemistry environments. This material has the best combination of wear life and mechanical strength and stiffness ... ideal for the most demanding applications and in extreme process environments.
KEY PROPERTIES • Good for both wet and dry environments • High strength and rigidity • Excellent stain resistance • Good wear resistance • Excellent dimensional stability
|
TYPICAL PROPERTIES of SEMITRON CMP | |||
| ASTM or UL test | Property | Semitron ® CMP LL5 |
Semitron ® CMP XL20 |
| PHYSICAL | |||
| D792 | Density (lb/in³) (g/cm³) |
0.052 1.44 |
0.051 1.41 |
| D570 | Water Absorption, 24 hrs (%) | 0.06 | 0.4 |
| D570 | Water Absorption, saturation (%) | 0.47 | 1.7 |
| MECHANICAL | |||
| D638 | Tensile Strength (psi) | 10,500 | 18,000 |
| D638 | Tensile Modulus (psi) | 500,000 | 600,000 |
| D638 | Tensile Elongation at Break (%) | 5 | 10 |
| D790 | Flexural Strength (psi) | 14,000 | 24,000 |
| D790 | Flexural Modulus (psi) | 360,000 | 600,000 |
| D695 | Compressive Strength (psi) | 15,250 | 24,000 |
| D695 | Compressive Modulus (psi) | 400,000 | 478,000 |
| D732 | Shear Strength (psi) | 8,500 | 16,000 |
| D785 | Hardness, Rockwell | M94 | E80 / M120 |
| D256 | IZOD Notched Impact (ft-lb/in) | 0.4 | 2.0 |
| - | Coefficient of Friction Dynamic (dry vs. steel) |
0.19 | 0.35 |
| - | Limiting PV (with 4:1 safety factor) (ft-lb-in²-min) |
6,000 | 12,500 |
| - | Wear Factor "k" x 10-10 in³-min/ft-lbs-hr |
35 | 50 |
| THERMAL | |||
| D696 | Coefficient of Linear Thermal Expansion (x 10-5 in./in./°F) |
4.5 | 1.7 |
| D648 | Heat Deflection Temp (°F / °C) at 264 psi |
180 / 82 |
532 / 278 |
| D3418 | Tg Glass Transition Temperature (°F / °C) | n.a. | 527 / 275 |
| D3418 | Melting Temperature (°F / °C) | 491 / 255 | n.a. |
| - | Max Operating Temp (°F / °C) | 210 / 99 | 500 / 260 |
| C177 | Thermal Conductivity (BTU-in/ft²-hr-°F) (x 10-4 cal/cm-sec-°C) |
1.9 6.6 |
1.8 6.3 |
| UL94 | Flammability Rating | HB | V-0 |
| ELECTRICAL | |||
| D149 | Dielectric Strength (V/mil) short time, 1/8" thick | - | 580 |
| D150 | Dielectric Constant at 1 MHz | 3.6 | 4.2 |
| D150 | Dissipation Factor at 1 MHz | 0.02 | 0.026 |
| D257 | Surface Resistivity (ohm/square)at 50% RH | > 1013 | > 1016 |
| IONIC IMPURITIES (by total digestion) | |||
| ICP/MS | Na (sodium), ppm | 2.2 | 3.9 |
| ICP/MS | K (potassium), ppm | 12 | 0.5 |
| ICP/MS | Fe (iron), ppm | 8.2 | 1.5 |
| OUTGASSING | |||
| E595 | TML (total mass loss), % | 0.15 | 1.85 |
| E595 | CVCM (collected volatile condensable material), % | 0.00 | 0.00 |
| E595 | WVR (water vapor recovered), % | 0.05 | 0.49 |
NOTE: The information contained herein are typical values intended for reference and comparison purposes only. They should NOT be used as a basis for design specifications or quality control. Contact us for manufacturers' complete material property datasheets.SEMITRON is a registered trademark of Quadrant Engineering Plastic Products.
All values at 73°F (23°C) unless otherwise noted.
©
Copyright Boedeker Plastics, Inc.
2008